Wafer bonding technologies for nano-, micro- and macro-system realization and integration
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource, 13 Seiten
- Sprache
-
Englisch
- Anmerkungen
-
In: Engineering for a Changing World
In: Ilmenau Scientific Colloquium. Technische Universität Ilmenau ; 60 (Ilmenau) : 2023.09.04-08
In: ilmedia, Ilmenau
- Klassifikation
-
Elektrotechnik, Elektronik
- Ereignis
-
Veröffentlichung
- (wo)
-
Ilmenau
- (wer)
-
TU Ilmenau
- (wann)
-
2023
- Urheber
- URN
-
urn:nbn:de:gbv:ilm1-2023isc-113:5
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 11:02 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Knechtel, Roy
- Schwarz, Uwe
- TU Ilmenau
Entstanden
- 2023
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