- Sprache
-
Englisch
- Umfang
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XV, 499 S.
- ISBN
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978-3-540-21049-8
- Identifier
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970038399
- Reihe
-
Springer series in materials science; 75
Thema
Wafer ; Bonden ; Aufsatzsammlung
Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Der Zugriff auf Teile des Objekts ist unbeschränkt möglich.
- Letzte Aktualisierung
-
16.08.2023, 18:37 MESZ
Objekttyp
- Monografie
Beteiligte
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