Wafer bonding : applications and technology

Aufsatzsammlung

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on- insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non- specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. TOC:Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the World-Wide Moving Front of the State-of-the-Art of Contact Bonding.- Basics of Silicon-on-Insulator (SOI) Technology.- Silicon-on-Insulator by the Smart CutTM Process.- ELTRAN Technology Based on Wafer Bonding and Porous Silicon.- Wafer Bonding for High Performance Logic Applications.- Application of Bonded Wafers to the Fabrication of Electronic Devices.- Compound Semiconductor Heterostructures by Smart CutTM: SiC-on-Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach.- Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- High-Density Hybrid Integration of III-V Compound Optoelectronics with Silicon Integrated Circuits.- Layer Transfer by Bonding and Laser Lift- off.- Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- Wafer Bonding of Ferroelectric Materials.- Debonding of Wafer-bonded Interfaces for Handling and Transfer Applications.

Angaben zum Objekt

• Standort: Deutsche Nationalbibliothek Frankfurt am Main
• ISBN: 9783540210498 ; 3540210490
• Maße: 24 cm
• Umfang: XV, 499 S.
• Sprache: Englisch
• Anmerkungen: Ill., graph. Darst. ; Literaturangaben

Verweise und Beziehungen

• Erschienen in: Springer series in materials science ; 75

Klassifikation und Themen

• Klassifikation: Ingenieurwissenschaften und Maschinenbau
• Schlagwort: Wafer ; Bonden

Beteiligte, Orts- und Zeitangaben

• Ereignis: Veröffentlichung
• (wo): Berlin, Heidelberg, New York, Hong Kong, Londson, Milan, Paris, Tokyo
• (wer): Springer
• (wann): 2004
• Beteiligte Personen und Organisationen: Alexe, Marin

Weitere Informationen

• Inhaltsverzeichnis: https://d-nb.info/970038399/04
• Rechteinformation: Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
• Letzte Aktualisierung: 11.06.2025, 13:55 MESZ