Konferenzschrift
Semiconductor wafer bonding: science, technology and applications : proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications : [Phoenix, AZ, October 13 - 18, 1991]
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
1566770084
- Dimensions
-
23 cm
- Extent
-
IX, 498 S.
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
Literaturangaben
- Bibliographic citation
-
Proceedings / Electrochemical Society ; Vol. 92,7
- Event
-
Veröffentlichung
- (where)
-
Pennington, NJ
- (who)
-
Electrochemical Soc.
- (when)
-
c 1992
- Contributor
-
Gösele, Ulrich
Electrochemical Society
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (1 : 1991 : Phoenix, Ariz.)
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 2:22 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Konferenzschrift
Associated
- Gösele, Ulrich
- Electrochemical Society
- International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (1 : 1991 : Phoenix, Ariz.)
- Electrochemical Soc.
Time of origin
- c 1992
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Role of humidity and surface roughness on direct wafer bonding
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Using both faces of polar semiconductor wafers for functional devices
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Role of humidity and surface roughness on direct wafer bonding
Electronic properties of interfaces produced by silicon wafer hydrophilic bonding
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