- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
1 Online-Ressource.
- Sprache
-
Englisch
- Erschienen in
-
Role of humidity and surface roughness on direct wafer bonding ; volume:97 ; number:4 ; day:17 ; month:4 ; year:2024 ; pages:1-13 ; date:4.2024
The European physical journal / B. B, Condensed matter and complex systems ; 97, Heft 4 (17.4.2024), 1-13, 4.2024
- Urheber
-
Persson, B. N. J.
Mate, C. Mathew
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1140/epjb/s10051-024-00680-w
- URN
-
urn:nbn:de:101:1-2407242107429.154500273121
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:55 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Persson, B. N. J.
- Mate, C. Mathew
- SpringerLink (Online service)
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