Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1543-186X
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Anmerkungen
-
online resource.
- Erschienen in
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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization ; volume:42 ; number:12 ; day:30 ; month:8 ; year:2013 ; pages:3582-3592 ; date:12.2013
Journal of electronic materials ; 42, Heft 12 (30.8.2013), 3582-3592, 12.2013
- Urheber
-
Luu, Thi-Thuy
Duan, Ani
Aasmundtveit, Knut E.
Hoivik, Nils
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-013-2711-z
- URN
-
urn:nbn:de:101:1-2022021321065886232181
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
2025-08-15T07:28:09+0200
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Beteiligte
- Luu, Thi-Thuy
- Duan, Ani
- Aasmundtveit, Knut E.
- Hoivik, Nils
- SpringerLink (Online service)
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