Role of humidity and surface roughness on direct wafer bonding

Location
Deutsche Nationalbibliothek Frankfurt am Main
Extent
1 Online-Ressource.
Language
Englisch

Bibliographic citation
Role of humidity and surface roughness on direct wafer bonding ; volume:97 ; number:4 ; day:17 ; month:4 ; year:2024 ; pages:1-13 ; date:4.2024
The European physical journal / B. B, Condensed matter and complex systems ; 97, Heft 4 (17.4.2024), 1-13, 4.2024

Creator
Persson, B. N. J.
Mate, C. Mathew
Contributor
SpringerLink (Online service)

DOI
10.1140/epjb/s10051-024-00680-w
URN
urn:nbn:de:101:1-2407242107429.154500273121
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 10:55 AM CEST

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Associated

  • Persson, B. N. J.
  • Mate, C. Mathew
  • SpringerLink (Online service)

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