3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
Chemnitz, Technische Universität Chemnitz, Dissertation, 2017
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Packaging
Silicon
MEMS
Gehäuse
Galvanische Abscheidung
Kupfer
- Event
-
Veröffentlichung
- (where)
-
Chemnitz
- (who)
-
Universitätsbibliothek Chemnitz
- (when)
-
2017
- Creator
- Contributor
-
Schulz, Stefan E.
Schulz, Stefan E.
Gerlach, Gerald
- URN
-
urn:nbn:de:bsz:ch1-qucosa-231412
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
25.03.2025, 1:47 PM CET
Data provider
This object is provided by:
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Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Hofmann, Lutz
- Schulz, Stefan E.
- Gerlach, Gerald
- Universitätsbibliothek Chemnitz
Time of origin
- 2017
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Miniaturisierter CO₂-Sensor mit wafer-gebondetem photoakustischen MEMS-Detektor
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Laser-induced Particle Removal from Silicon Wafers
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Product engineering for silicon based MEMS IP
Silicon MEMS technologies for novel neural probes
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Laser cleaning of silicon wafers : mechanisms and efficiencies
Silicon-based neural devices : packaging and application
Electromagnetic modeling and optimization of through silicon vias
Technologies for the integration of Through Silicon Vias in MEMS packages
Rotational grinding of silicon wafers
Miniaturisierter CO₂-Sensor mit wafer-gebondetem photoakustischen MEMS-Detektor
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Laser-induced Particle Removal from Silicon Wafers
Laser assisted particle removal from Silicon wafers
Product engineering for silicon based MEMS IP
Silicon MEMS technologies for novel neural probes
Laser cleaning of silicon wafers : prospects and problems
Laser cleaning of silicon wafers : mechanisms and efficiencies
Silicon-based neural devices : packaging and application