Konferenzschrift | Kongress
Special issue on WaferBond'11, "International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration"
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Dimensions
-
28 cm
- Extent
-
S. 646 - 772
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
Literaturangaben
- Bibliographic citation
-
Microsystem technologies ; Vol. 19, No. 5
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Bonden
Dreidimensionale Integration
Wafer-Integration
MEMS
- Event
-
Veröffentlichung
- (where)
-
Berlin, Heidelberg
- (who)
-
Springer
- (when)
-
2013
- Contributor
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.03.2025, 11:54 AM CET
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Konferenzschrift
- Kongress
Associated
- Michel, Bernd
- WaferBond (2011 : Chemnitz)
- Springer
Time of origin
- 2013
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