- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
1 Online-Ressource.
- Sprache
-
Englisch
- Erschienen in
-
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder ; volume:35 ; number:6 ; day:21 ; month:2 ; year:2024 ; pages:1-12 ; date:2.2024
Journal of materials science / Materials in electronics ; 35, Heft 6 (21.2.2024), 1-12, 2.2024
- Urheber
-
Feng, Tianshi
Pati, Bhabana
Chung, Ka Man
Pei, Yu
Chen, Renkun
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s10854-024-12176-5
- URN
-
urn:nbn:de:101:1-2405140823116.463463804276
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:54 MESZ
Datenpartner
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Beteiligte
- Feng, Tianshi
- Pati, Bhabana
- Chung, Ka Man
- Pei, Yu
- Chen, Renkun
- SpringerLink (Online service)
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