Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
1 Online-Ressource.
- Sprache
-
Englisch
- Erschienen in
-
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification ; volume:53 ; number:12 ; day:20 ; month:9 ; year:2024 ; pages:8024-8038 ; date:12.2024
Journal of electronic materials ; 53, Heft 12 (20.9.2024), 8024-8038, 12.2024
- Urheber
-
Sun, Sihan
Xian, Jingwei
Hsieh, Chen-Lin
Gourlay, Christopher M.
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-024-11447-5
- URN
-
urn:nbn:de:101:1-2502062152368.107758841024
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
15.08.2025, 07:37 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Sun, Sihan
- Xian, Jingwei
- Hsieh, Chen-Lin
- Gourlay, Christopher M.
- SpringerLink (Online service)
Ähnliche Objekte (12)
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Werkstoffkundlich-vergleichende Untersuchungen metallischer Füllungswerkstoffe der Systeme Ag-Sn-Cu/Ga-In-Sn (Galloy) und Ag-Sn-Cu/Hg (Amalcap Plus)
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag 3 Sn Phase
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Werkstoffkundlich-vergleichende Untersuchungen metallischer Füllungswerkstoffe der Systeme Ag-Sn-Cu/Ga-In-Sn (Galloy) und Ag-Sn-Cu/Hg (Amalcap Plus)
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag 3 Sn Phase
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Werkstoffkundlich-vergleichende Untersuchungen metallischer Füllungswerkstoffe der Systeme Ag-Sn-Cu/Ga-In-Sn (Galloy) und Ag-Sn-Cu/Hg (Amalcap Plus)
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag 3 Sn Phase
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints