Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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1 Online-Ressource.
- Language
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Englisch
- Bibliographic citation
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Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification ; volume:53 ; number:12 ; day:20 ; month:9 ; year:2024 ; pages:8024-8038 ; date:12.2024
Journal of electronic materials ; 53, Heft 12 (20.9.2024), 8024-8038, 12.2024
- Creator
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Sun, Sihan
Xian, Jingwei
Hsieh, Chen-Lin
Gourlay, Christopher M.
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s11664-024-11447-5
- URN
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urn:nbn:de:101:1-2502062152368.107758841024
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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15.08.2025, 7:37 AM CEST
Data provider
This object is provided by:
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Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Sun, Sihan
- Xian, Jingwei
- Hsieh, Chen-Lin
- Gourlay, Christopher M.
- SpringerLink (Online service)
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Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Werkstoffkundlich-vergleichende Untersuchungen metallischer Füllungswerkstoffe der Systeme Ag-Sn-Cu/Ga-In-Sn (Galloy) und Ag-Sn-Cu/Hg (Amalcap Plus)
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag 3 Sn Phase
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
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Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Werkstoffkundlich-vergleichende Untersuchungen metallischer Füllungswerkstoffe der Systeme Ag-Sn-Cu/Ga-In-Sn (Galloy) und Ag-Sn-Cu/Hg (Amalcap Plus)
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag 3 Sn Phase
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints