Fatigue fracture of SnAgCu solder joints by microstructural modeling

Location
Deutsche Nationalbibliothek Frankfurt am Main
ISSN
1573-2673
Extent
Online-Ressource
Language
Englisch
Notes
online resource.

Bibliographic citation
Fatigue fracture of SnAgCu solder joints by microstructural modeling ; volume:152 ; number:1 ; day:21 ; month:10 ; year:2008 ; pages:37-49 ; date:7.2008
International journal of fracture ; 152, Heft 1 (21.10.2008), 37-49, 7.2008

Creator
Erinc, M.
Assman, T. M.
Schreurs, P. J. G.
Geers, M. G. D.
Contributor
SpringerLink (Online service)

DOI
10.1007/s10704-008-9264-9
URN
urn:nbn:de:101:1-2023050722415881278425
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 10:58 AM CEST

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Associated

  • Erinc, M.
  • Assman, T. M.
  • Schreurs, P. J. G.
  • Geers, M. G. D.
  • SpringerLink (Online service)

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