Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Anmerkungen
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online resource.
- Erschienen in
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Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy ; volume:34 ; number:7 ; day:21 ; month:2 ; year:2023 ; pages:1-15 ; date:3.2023
Journal of materials science / Materials in electronics ; 34, Heft 7 (21.2.2023), 1-15, 3.2023
- Urheber
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El-Taher, A. M.
Abd Elmoniem, H. M.
Mosaad, S.
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s10854-023-09967-7
- URN
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urn:nbn:de:101:1-2023081121173864511549
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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14.08.2025, 10:53 MESZ
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Beteiligte
- El-Taher, A. M.
- Abd Elmoniem, H. M.
- Mosaad, S.
- SpringerLink (Online service)
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