Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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online resource.
- Bibliographic citation
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Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy ; volume:34 ; number:7 ; day:21 ; month:2 ; year:2023 ; pages:1-15 ; date:3.2023
Journal of materials science / Materials in electronics ; 34, Heft 7 (21.2.2023), 1-15, 3.2023
- Creator
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El-Taher, A. M.
Abd Elmoniem, H. M.
Mosaad, S.
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s10854-023-09967-7
- URN
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urn:nbn:de:101:1-2023081121173864511549
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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14.08.2025, 10:53 AM CEST
Data provider
This object is provided by:
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Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- El-Taher, A. M.
- Abd Elmoniem, H. M.
- Mosaad, S.
- SpringerLink (Online service)
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