Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1543-186X
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Anmerkungen
-
online resource.
- Erschienen in
-
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles ; day:5 ; month:8 ; year:2016 ; pages:1-7
Journal of electronic materials ; (5.8.2016), 1-7
- Urheber
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Yakymovych, A.
- Beteiligte Personen und Organisationen
-
Plevachuk, Yu
Švec, P.
Janičkovič, D.
Šebo, P.
Beronská, N.
Roshanghias, A.
Ipser, H.
SpringerLink (Online service)
- DOI
-
10.1007/s11664-016-4832-7
- URN
-
urn:nbn:de:1111-201609037320
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:49 MESZ
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Beteiligte
- Yakymovych, A.
- Plevachuk, Yu
- Švec, P.
- Janičkovič, D.
- Šebo, P.
- Beronská, N.
- Roshanghias, A.
- Ipser, H.
- SpringerLink (Online service)
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