Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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1 Online-Ressource.
- Language
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Englisch
- Bibliographic citation
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Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility ; volume:9 ; number:1 ; day:23 ; month:10 ; year:2023 ; pages:1-10 ; date:12.2023
npj computational materials ; 9, Heft 1 (23.10.2023), 1-10, 12.2023
- Creator
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Wei, Qinghua
Cao, Bin
Yuan, Hao
Chen, Youyang
You, Kangdong
Yu, Shuting
Yang, Tixin
Dong, Ziqiang
Zhang, Tong-Yi
- Contributor
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SpringerLink (Online service)
- DOI
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10.1038/s41524-023-01150-0
- URN
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urn:nbn:de:101:1-2024013114424752356436
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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15.08.2025, 7:35 AM CEST
Data provider
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Associated
- Wei, Qinghua
- Cao, Bin
- Yuan, Hao
- Chen, Youyang
- You, Kangdong
- Yu, Shuting
- Yang, Tixin
- Dong, Ziqiang
- Zhang, Tong-Yi
- SpringerLink (Online service)
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Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Micromechanical characterization of lead-free solder and its individual microstructure elements
Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
High strength nanocrystalline Cu–Co alloys with high tensile ductility
High strength nanocrystalline Cu–Co alloys with high tensile ductility
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Overcoming strength-ductility tradeoff with high pressure thermal treatment
Reliability of solder interconnects under high current loading conditions
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Research into the interface of lead-free solder joints
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Micromechanical characterization of lead-free solder and its individual microstructure elements
Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
High strength nanocrystalline Cu–Co alloys with high tensile ductility
High strength nanocrystalline Cu–Co alloys with high tensile ductility
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Overcoming strength-ductility tradeoff with high pressure thermal treatment
Reliability of solder interconnects under high current loading conditions