Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility ; volume:9 ; number:1 ; day:23 ; month:10 ; year:2023 ; pages:1-10 ; date:12.2023
npj computational materials ; 9, Heft 1 (23.10.2023), 1-10, 12.2023
- Urheber
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Wei, Qinghua
Cao, Bin
Yuan, Hao
Chen, Youyang
You, Kangdong
Yu, Shuting
Yang, Tixin
Dong, Ziqiang
Zhang, Tong-Yi
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1038/s41524-023-01150-0
- URN
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urn:nbn:de:101:1-2024013114424752356436
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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15.08.2025, 07:35 MESZ
Datenpartner
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Beteiligte
- Wei, Qinghua
- Cao, Bin
- Yuan, Hao
- Chen, Youyang
- You, Kangdong
- Yu, Shuting
- Yang, Tixin
- Dong, Ziqiang
- Zhang, Tong-Yi
- SpringerLink (Online service)
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