Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource, 1 online resource.
- Language
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Englisch
- Bibliographic citation
-
Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites ; day:7 ; month:7 ; year:2023 ; pages:1-11
Applied nanoscience ; (7.7.2023), 1-11
- Creator
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Plevachuk, Yuriy
Švec, Peter
Orovcik, Lubomir
Bajana, Otto
Yakymovych, Andriy
Rud, Alexander
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s13204-023-02898-z
- URN
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urn:nbn:de:101:1-2023101110182575879979
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:46 AM CEST
Data provider
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Associated
- Plevachuk, Yuriy
- Švec, Peter
- Orovcik, Lubomir
- Bajana, Otto
- Yakymovych, Andriy
- Rud, Alexander
- SpringerLink (Online service)
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Micromechanical characterization of lead-free solder and its individual microstructure elements
Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints
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Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Boride Coatings on Steel Protecting it Against Corrosion by a Liquid Lead-Free Solder Alloy
Research into the interface of lead-free solder joints
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Micromechanical characterization of lead-free solder and its individual microstructure elements
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