- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1543-186X
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength ; day:13 ; month:5 ; year:2016 ; pages:1-10
Journal of electronic materials ; (13.5.2016), 1-10
- Creator
-
Roshanghias, Ali
- Contributor
-
Khatibi, Golta
Yakymovych, Andriy
Bernardi, Johannes
Ipser, Herbert
SpringerLink (Online service)
- DOI
-
10.1007/s11664-016-4584-4
- URN
-
urn:nbn:de:1111-2016051820079
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:48 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Roshanghias, Ali
- Khatibi, Golta
- Yakymovych, Andriy
- Bernardi, Johannes
- Ipser, Herbert
- SpringerLink (Online service)
Other Objects (12)
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SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing