Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints

Location
Deutsche Nationalbibliothek Frankfurt am Main
ISSN
1573-482X
Extent
Online-Ressource
Language
Englisch
Notes
online resource.

Bibliographic citation
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints ; day:31 ; month:10 ; year:2018 ; pages:1-13
Journal of materials science / Materials in electronics ; (31.10.2018), 1-13

Classification
Industrielle und handwerkliche Fertigung

Creator
Belyakov, S. A.
Xian, J.
Zeng, G.
Sweatman, K.
Nishimura, T.
Akaiwa, T.
Gourlay, C. M.
Contributor
SpringerLink (Online service)

DOI
10.1007/s10854-018-0302-8
URN
urn:nbn:de:101:1-2018121919454718166130
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 10:53 AM CEST

Data provider

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Associated

  • Belyakov, S. A.
  • Xian, J.
  • Zeng, G.
  • Sweatman, K.
  • Nishimura, T.
  • Akaiwa, T.
  • Gourlay, C. M.
  • SpringerLink (Online service)

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