Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1573-482X
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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online resource.
- Bibliographic citation
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Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints ; day:31 ; month:10 ; year:2018 ; pages:1-13
Journal of materials science / Materials in electronics ; (31.10.2018), 1-13
- Classification
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Industrielle und handwerkliche Fertigung
- Creator
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Belyakov, S. A.
Xian, J.
Zeng, G.
Sweatman, K.
Nishimura, T.
Akaiwa, T.
Gourlay, C. M.
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s10854-018-0302-8
- URN
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urn:nbn:de:101:1-2018121919454718166130
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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13.08.2025, 10:53 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Belyakov, S. A.
- Xian, J.
- Zeng, G.
- Sweatman, K.
- Nishimura, T.
- Akaiwa, T.
- Gourlay, C. M.
- SpringerLink (Online service)
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Fatigue fracture of SnAgCu solder joints by microstructural modeling
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Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux
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