Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1573-482X
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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online resource.
- Bibliographic citation
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Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints ; day:31 ; month:10 ; year:2018 ; pages:1-13
Journal of materials science / Materials in electronics ; (31.10.2018), 1-13
- Classification
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Industrielle und handwerkliche Fertigung
- Creator
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Belyakov, S. A.
Xian, J.
Zeng, G.
Sweatman, K.
Nishimura, T.
Akaiwa, T.
Gourlay, C. M.
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s10854-018-0302-8
- URN
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urn:nbn:de:101:1-2018121919454718166130
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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14.08.2025, 10:53 AM CEST
Data provider
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Belyakov, S. A.
- Xian, J.
- Zeng, G.
- Sweatman, K.
- Nishimura, T.
- Akaiwa, T.
- Gourlay, C. M.
- SpringerLink (Online service)