- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
1 Online-Ressource.
- Language
-
Englisch
- Bibliographic citation
-
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder ; volume:35 ; number:6 ; day:21 ; month:2 ; year:2024 ; pages:1-12 ; date:2.2024
Journal of materials science / Materials in electronics ; 35, Heft 6 (21.2.2024), 1-12, 2.2024
- Creator
-
Feng, Tianshi
Pati, Bhabana
Chung, Ka Man
Pei, Yu
Chen, Renkun
- Contributor
-
SpringerLink (Online service)
- DOI
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10.1007/s10854-024-12176-5
- URN
-
urn:nbn:de:101:1-2405140823116.463463804276
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:54 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Feng, Tianshi
- Pati, Bhabana
- Chung, Ka Man
- Pei, Yu
- Chen, Renkun
- SpringerLink (Online service)
Other Objects (12)
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Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
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Fatigue fracture of SnAgCu solder joints by microstructural modeling
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
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Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds
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Patient Jacob Solder
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Influence of the Substrate on the Creep of SN Solder Joints
Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds
Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
Patient Jacob Solder
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Effect of Au-deposited ceramic nanoparticles on SAC305/Cu solder joints
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Influence of the Substrate on the Creep of SN Solder Joints
Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds
Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints