- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization ; volume:42 ; number:12 ; day:30 ; month:8 ; year:2013 ; pages:3582-3592 ; date:12.2013
Journal of electronic materials ; 42, Heft 12 (30.8.2013), 3582-3592, 12.2013
- Creator
-
Luu, Thi-Thuy
Duan, Ani
Aasmundtveit, Knut E.
Hoivik, Nils
- Contributor
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-013-2711-z
- URN
-
urn:nbn:de:101:1-2022021321065886232181
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
15.08.2025, 7:28 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Luu, Thi-Thuy
- Duan, Ani
- Aasmundtveit, Knut E.
- Hoivik, Nils
- SpringerLink (Online service)
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