Quantitative analysis of electromigration-induced damage in Al-based interconnects
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
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Englisch
- Anmerkungen
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In: Materials reliability in microelectronics II : symposium held April 27 - May 1, 1992, San Francisco, California, U.S.A. / ed.: C. V. Thompson ... - Pittsburgh, Pa. : Materials Research Society, 1992. - (Materials Research Society symposium proceedings ; 265), S. 119-124
- Klassifikation
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Ingenieurwissenschaften und Maschinenbau
- Schlagwort
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Quantitative Analyse ; Elektromigration
- Ereignis
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Veröffentlichung
- (wo)
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Saarbrücken
- (wer)
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Saarländische Universitäts- und Landesbibliothek
- (wann)
-
2008
- Urheber
- URN
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urn:nbn:de:bsz:291-scidok-17909
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:53 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Kraft, Oliver
- Sanchez, J. E.
- Arzt, Eduard
- Saarländische Universitäts- und Landesbibliothek
Entstanden
- 2008
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