Detailed study of electromigration induced damage in Al and AlCuSi interconnects
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
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Englisch
- Anmerkungen
-
In: Materials reliability in microelectronics IV : symposium held April 5 - 8, 1994, San Francisco, California, U.S.A. ... / Ed.: Peter Børgesen ... - Pittsburgh, Pa. : Materials Research Soc., 1994. - (Materials Research Society symposium proceedings ; 338), S. 373-378
- Klassifikation
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Ingenieurwissenschaften und Maschinenbau
- Schlagwort
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Oberflächenschaden ; Elektromigration ; Studie
- Ereignis
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Veröffentlichung
- (wo)
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Saarbrücken
- (wer)
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Saarländische Universitäts- und Landesbibliothek
- (wann)
-
2008
- Beteiligte Personen und Organisationen
- URN
-
urn:nbn:de:bsz:291-scidok-17952
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:54 MEZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Möckl, U. E.
- Bauer, M.
- Kraft, Oliver
- Sanchez, J. E.
- Arzt, Eduard
- Saarländische Universitäts- und Landesbibliothek
Entstanden
- 2008
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