Hochschulschrift
Plated copper front side metallization on printed seed-layers for silicon solar cells
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783839609392
3839609399
- Maße
-
21 cm
- Umfang
-
287 Seiten
- Sprache
-
Englisch
- Anmerkungen
-
Illustrationen
Albert-Ludwigs-Universität Freiburg im Breisgau, Dissertation, 2015
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Solarzelle
Siliciumbauelement
Kontaktieren
Vorderseite
Metallisieren
Kupfer
Korrosion
Lebensdauer
Galvanische Abscheidung
Drucktechnik
- Ereignis
-
Veröffentlichung
- (wo)
-
Stuttgart
- (wer)
-
Fraunhofer Verlag
- (wann)
-
[2015]
- Urheber
- Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 14:16 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Objekttyp
- Hochschulschrift
Beteiligte
- Kraft, Achim
- Fraunhofer IRB-Verlag
- Fraunhofer ISE, Freiburg/Brsg.
- Fraunhofer Verlag
Entstanden
- [2015]
Ähnliche Objekte (12)
Plated copper front side metallization on printed seed-layers for silicon solar cells
Silicon grown from silicon-rich tin solution : from crystallization of the seed layer to prototype solar cells
ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Investigation of the back side passivation layer of screen printed bifacial silicon solar cells
Copper metallization on silicon power devices for heavy copper wire-bonding
The reaction path of copper in silicon
Copper and hydrogen related defects in silicon
Nanocrystalline silicon and silicon oxide contact layers for silicon heterojunction solar cells
Infrared absorption of porous silicon layers and silicon particle films
Electroless nickel and copper metallization : Contact formation on crystalline silicon and background plating behavior on PECVD silicon SiN<sub>x</sub>:H layers
3D printed nozzles on a silicon fluidic chip
Crystalline silicon carbide intermediate layers for silicon thin-film solar cells
Plated copper front side metallization on printed seed-layers for silicon solar cells
Silicon grown from silicon-rich tin solution : from crystallization of the seed layer to prototype solar cells
ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Investigation of the back side passivation layer of screen printed bifacial silicon solar cells
Copper metallization on silicon power devices for heavy copper wire-bonding
The reaction path of copper in silicon
Copper and hydrogen related defects in silicon
Nanocrystalline silicon and silicon oxide contact layers for silicon heterojunction solar cells
Infrared absorption of porous silicon layers and silicon particle films
Electroless nickel and copper metallization : Contact formation on crystalline silicon and background plating behavior on PECVD silicon SiN<sub>x</sub>:H layers
3D printed nozzles on a silicon fluidic chip
Crystalline silicon carbide intermediate layers for silicon thin-film solar cells
Plated copper front side metallization on printed seed-layers for silicon solar cells
Silicon grown from silicon-rich tin solution : from crystallization of the seed layer to prototype solar cells
ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Investigation of the back side passivation layer of screen printed bifacial silicon solar cells
Copper metallization on silicon power devices for heavy copper wire-bonding
The reaction path of copper in silicon
Copper and hydrogen related defects in silicon
Nanocrystalline silicon and silicon oxide contact layers for silicon heterojunction solar cells
Infrared absorption of porous silicon layers and silicon particle films
Electroless nickel and copper metallization : Contact formation on crystalline silicon and background plating behavior on PECVD silicon SiN<sub>x</sub>:H layers
3D printed nozzles on a silicon fluidic chip