Hochschulschrift
Copper metallization on silicon power devices for heavy copper wire-bonding
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783844049312
3844049312
- Maße
-
21 cm
- Umfang
-
XIV, 201 Seiten
- Ausgabe
-
[1. Auflage]
- Sprache
-
Englisch
- Anmerkungen
-
Illustrationen
Technische Universität Berlin, Dissertation, 2016
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Leistungshalbleiter
Silicium
Kupfer
Metallisieren
Dickdrahtbonden
Mikrostruktur
Einflussgröße
Strombelastung
Diffusionsbarriere
Degradation
- Ereignis
-
Veröffentlichung
- (wo)
-
Aachen
- (wer)
-
Shaker Verlag
- (wann)
-
2016
- Urheber
- Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 14:29 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Objekttyp
- Hochschulschrift
Beteiligte
- Gross, David
- Shaker Verlag
- Shaker Verlag
Entstanden
- 2016
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