Requirements and challenges on an alternative indirect integration regime of low-k materials

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Location: Deutsche Nationalbibliothek Frankfurt am Main

Extent: Online-Ressource

Language: Englisch

Notes: In: AMC 2015 – Advanced Metallization Conference

Keyword: Low-k-Dielektrikum
Opferschicht

Event: Veröffentlichung

(where): Chemnitz

(who): Universitätsbibliothek Chemnitz

(when): 2016

Event: Veröffentlichung

(where): Chemnitz

(who): Technische Universität Chemnitz

(when): 2016

Creator: Haase, Micha
Ecke, Ramona
Schulz, Stefan E.

URN: urn:nbn:de:bsz:ch1-qucosa-207219

Rights: Der Zugriff auf das Objekt ist unbeschränkt möglich.

Last update: 14.08.2025, 10:56 AM CEST

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Associated

Haase, Micha
Ecke, Ramona
Schulz, Stefan E.
Universitätsbibliothek Chemnitz
Technische Universität Chemnitz

Time of origin

2016

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Requirements and challenges on an alternative indirect integration regime of low-k materials

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Other Objects (12)

Electron microscopic studies of low-k inter-metal dielectrics

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3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias

Investigation of multicomponent catalyst systems for type-selective growth of SWCNTs by CVD

Reaction Paths of Repair Fragments on Damaged Ultra-low-k Surfaces

Atomic Layer Deposition and Microanalysis of Ultrathin Layers

Graphene-Based Conductor Materials: Assessment of the Electrical Conductivity

Atomistische Simulationen der Diffusionsprozesse in SiGe Verbindungen

Improvement of carbon nanotube-based field-effect transistors by cleaning and passivation

Reduction of Copper Oxide by Formic Acid : an ab-initio study

Growth of carbon nanotubes on different support/catalyst systems for advanced interconnects in integrated circuits : Growth of carbon nanotubes on different support/catalystsystems for advanced interconnects in integrated circuits

Ab-initio studies of reactions to functionalize carbon nanotubes

Electron microscopic studies of low-k inter-metal dielectrics

Herstellung ultraschmaler Leitbahnen mit herkömmlichen Prozessen und Untersuchungen zum Pore Sealing bei porösen low-k Dielektrika

3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias

Investigation of multicomponent catalyst systems for type-selective growth of SWCNTs by CVD

Reaction Paths of Repair Fragments on Damaged Ultra-low-k Surfaces

Atomic Layer Deposition and Microanalysis of Ultrathin Layers

Graphene-Based Conductor Materials: Assessment of the Electrical Conductivity

Atomistische Simulationen der Diffusionsprozesse in SiGe Verbindungen

Improvement of carbon nanotube-based field-effect transistors by cleaning and passivation

Reduction of Copper Oxide by Formic Acid : an ab-initio study

Growth of carbon nanotubes on different support/catalyst systems for advanced interconnects in integrated circuits : Growth of carbon nanotubes on different support/catalystsystems for advanced interconnects in integrated circuits

Ab-initio studies of reactions to functionalize carbon nanotubes

Electron microscopic studies of low-k inter-metal dielectrics

Herstellung ultraschmaler Leitbahnen mit herkömmlichen Prozessen und Untersuchungen zum Pore Sealing bei porösen low-k Dielektrika

3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias

Investigation of multicomponent catalyst systems for type-selective growth of SWCNTs by CVD

Reaction Paths of Repair Fragments on Damaged Ultra-low-k Surfaces

Atomic Layer Deposition and Microanalysis of Ultrathin Layers

Graphene-Based Conductor Materials: Assessment of the Electrical Conductivity

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Improvement of carbon nanotube-based field-effect transistors by cleaning and passivation

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Growth of carbon nanotubes on different support/catalyst systems for advanced interconnects in integrated circuits : Growth of carbon nanotubes on different support/catalystsystems for advanced interconnects in integrated circuits

Ab-initio studies of reactions to functionalize carbon nanotubes

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