Hochschulschrift
Interconnect planning for physical design of 3D integrated circuits
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783183455201
- Maße
-
21 cm
- Umfang
-
IX, 138 S.
- Ausgabe
-
Als Ms. gedr.
- Sprache
-
Englisch
- Anmerkungen
-
Ill., graph. Darst.
Zugl.: Dresden, Techn. Univ., Diss., 2014
- Erschienen in
-
Fortschritt-Berichte VDI / 20 / Verein Deutscher Ingenieure ; Nr. 455, Reihe 20, Rechnerunterstützte Verfahren
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Dreidimensionale Integration
Layout
Block-Layout
Durchkontaktieren
Silicium
Verbindungstechnik
Entwurfsautomation
VLSI
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 13:39 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Objekttyp
- Hochschulschrift
Beteiligte
- Knechtel, Johann
- VDI-Verl.
Entstanden
- 2014
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