Hochschulschrift
Interconnect planning for physical design of 3D integrated circuits
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783183455201
- Dimensions
-
21 cm
- Extent
-
IX, 138 S.
- Edition
-
Als Ms. gedr.
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
Zugl.: Dresden, Techn. Univ., Diss., 2014
- Bibliographic citation
-
Fortschritt-Berichte VDI / 20 / Verein Deutscher Ingenieure ; Nr. 455, Reihe 20, Rechnerunterstützte Verfahren
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Dreidimensionale Integration
Layout
Block-Layout
Durchkontaktieren
Silicium
Verbindungstechnik
Entwurfsautomation
VLSI
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 1:39 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
- Knechtel, Johann
- VDI-Verl.
Time of origin
- 2014
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