Hochschulschrift
Wetting optimized solutions for plasma etch residue removal for application in interconnect systems of integrated circuits
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783941003613
- Dimensions
-
21 cm
- Extent
-
VI, 233 S.
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
Zugl.: Chemnitz, Techn. Univ., Diss., 2012
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Low-k-Dielektrikum
Plasmaätzen
Schädigung
Oberflächenreinigung
Wässrige Lösung
Tensidlösung
Benetzung
Verbindungstechnik
ULSI
Tensid
Benetzung
ULSI
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 2:18 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
- Ahner, Nicole
- Univ.-Verl.
Time of origin
- 2013
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