Hochschulschrift
Wetting optimized solutions for plasma etch residue removal for application in interconnect systems of integrated circuits
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783941003613
- Maße
-
21 cm
- Umfang
-
VI, 233 S.
- Sprache
-
Englisch
- Anmerkungen
-
Ill., graph. Darst.
Zugl.: Chemnitz, Techn. Univ., Diss., 2012
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Low-k-Dielektrikum
Plasmaätzen
Schädigung
Oberflächenreinigung
Wässrige Lösung
Tensidlösung
Benetzung
Verbindungstechnik
ULSI
Tensid
Benetzung
ULSI
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 14:18 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Objekttyp
- Hochschulschrift
Beteiligte
- Ahner, Nicole
- Univ.-Verl.
Entstanden
- 2013
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