Hochschulschrift
Interconnect technology for three-dimensional chip integration
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783867274067
3867274061
- Maße
-
21 cm
- Umfang
-
XII, 117 S.
- Ausgabe
-
1. Aufl.
- Sprache
-
Englisch
- Anmerkungen
-
Ill., graph. Darst.
Zugl.: Ulm, Univ., Diss., 2007
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Dreidimensionale Integration
Mikromechanik
Dreidimensionale Integration
Halbleitertechnologie
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 14:13 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Objekttyp
- Hochschulschrift
Beteiligte
- Munding, Andreas
- Cuvillier
Entstanden
- 2007
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