Hochschulschrift
Interconnect technology for three-dimensional chip integration
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
Ulm, Univ., Diss., 2007
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
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Dreidimensionale Integration
Mikromechanik
Dreidimensionale Integration
Halbleitertechnologie
- Urheber
- URN
-
urn:nbn:de:bsz:289-vts-60262
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.02.2025, 13:57 MEZ
Datenpartner
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Objekttyp
- Hochschulschrift
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