- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints ; volume:37 ; number:1 ; day:23 ; month:10 ; year:2007 ; pages:102-109 ; date:1.2008
Journal of electronic materials ; 37, Heft 1 (23.10.2007), 102-109, 1.2008
- Creator
-
Zimprich, Peter
Saeed, Usman
Betzwar-Kotas, Agnieszka
Weiss, Brigitte
Ipser, Herbert
- Contributor
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-007-0278-2
- URN
-
urn:nbn:de:101:1-2021061722031419158497
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:48 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Zimprich, Peter
- Saeed, Usman
- Betzwar-Kotas, Agnieszka
- Weiss, Brigitte
- Ipser, Herbert
- SpringerLink (Online service)
Other Objects (12)
Research into the interface of lead-free solder joints
Micromechanical characterization of lead-free solder and its individual microstructure elements
Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Boride Coatings on Steel Protecting it Against Corrosion by a Liquid Lead-Free Solder Alloy
Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys
Research into the interface of lead-free solder joints
Micromechanical characterization of lead-free solder and its individual microstructure elements
Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Boride Coatings on Steel Protecting it Against Corrosion by a Liquid Lead-Free Solder Alloy
Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys
Research into the interface of lead-free solder joints
Micromechanical characterization of lead-free solder and its individual microstructure elements
Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Boride Coatings on Steel Protecting it Against Corrosion by a Liquid Lead-Free Solder Alloy