Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1432-1858
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Anmerkungen
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online resource.
- Erschienen in
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Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections ; volume:15 ; number:1 ; day:29 ; month:4 ; year:2008 ; pages:101-107 ; date:1.2009
Microsystem technologies ; 15, Heft 1 (29.4.2008), 101-107, 1.2009
- Urheber
-
Huang, Zhiheng
Conway, Paul P.
Qin, Rongshan
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
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10.1007/s00542-008-0629-9
- URN
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urn:nbn:de:101:1-2021081422065406524226
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:48 MESZ
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Beteiligte
- Huang, Zhiheng
- Conway, Paul P.
- Qin, Rongshan
- SpringerLink (Online service)
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