Ambiphilic Al−Cu Bonding

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Location: Deutsche Nationalbibliothek Frankfurt am Main

Extent: Online-Ressource

Language: Englisch

Bibliographic citation: Ambiphilic Al−Cu Bonding ; day:20 ; month:05 ; year:2021 ; extent:5
Angewandte Chemie / International edition. International edition ; (20.05.2021) (gesamt 5)

Creator: Liu, Han‐Ying
Schwamm, Ryan J.
Hill, Michael S.
Mahon, Mary F.
McMullin, Claire L.
Rajabi, Nasir A.

DOI: 10.1002/anie.202104658

URN: urn:nbn:de:101:1-2021052115061111432371

Rights: Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.

Last update: 14.08.2025, 10:45 AM CEST

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Associated

Liu, Han‐Ying
Schwamm, Ryan J.
Hill, Michael S.
Mahon, Mary F.
McMullin, Claire L.
Rajabi, Nasir A.

Other Objects (12)

Ambiphilic Al−Cu Bonding

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Hochschulschrift

Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]

Ambiphilic Al−Cu Bonding

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Hochschulschrift

Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]

Ambiphilic Al−Cu Bonding

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Hochschulschrift

Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]

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Ambiphilic Al−Cu Bonding

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Other Objects (12)

Ambiphilic Al−Cu Bonding

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]

Ambiphilic Al−Cu Bonding

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]

Ambiphilic Al−Cu Bonding

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate

How Atomic Bonding Plays the Hardness Behavior in the Al–Co–Cr–Cu–Fe–Ni High Entropy Family

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]

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