Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1556-276X
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste ; volume:12 ; number:1 ; day:5 ; month:4 ; year:2017 ; pages:1-6 ; date:12.2017
Nanoscale research letters ; 12, Heft 1 (5.4.2017), 1-6, 12.2017
- Creator
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Li, Junjie
- Contributor
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Yu, Xing
Shi, Tielin
Cheng, Chaoliang
Fan, Jinhu
Cheng, Siyi
Liao, Guanglan
Tang, Zirong
SpringerLink (Online service)
- DOI
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10.1186/s11671-017-2037-5
- URN
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urn:nbn:de:1111-2017042214266
- Rights
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Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 11:04 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Li, Junjie
- Yu, Xing
- Shi, Tielin
- Cheng, Chaoliang
- Fan, Jinhu
- Cheng, Siyi
- Liao, Guanglan
- Tang, Zirong
- SpringerLink (Online service)
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