Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1556-276X
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
online resource.
- Erschienen in
-
Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste ; volume:12 ; number:1 ; day:5 ; month:4 ; year:2017 ; pages:1-6 ; date:12.2017
Nanoscale research letters ; 12, Heft 1 (5.4.2017), 1-6, 12.2017
- Urheber
-
Li, Junjie
- Beteiligte Personen und Organisationen
-
Yu, Xing
Shi, Tielin
Cheng, Chaoliang
Fan, Jinhu
Cheng, Siyi
Liao, Guanglan
Tang, Zirong
SpringerLink (Online service)
- DOI
-
10.1186/s11671-017-2037-5
- URN
-
urn:nbn:de:1111-2017042214266
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 11:04 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Li, Junjie
- Yu, Xing
- Shi, Tielin
- Cheng, Chaoliang
- Fan, Jinhu
- Cheng, Siyi
- Liao, Guanglan
- Tang, Zirong
- SpringerLink (Online service)
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