- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Erschienen in
-
Ambiphilic Al−Cu Bonding ; day:20 ; month:05 ; year:2021 ; extent:5
Angewandte Chemie / International edition. International edition ; (20.05.2021) (gesamt 5)
- Urheber
- DOI
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10.1002/anie.202104658
- URN
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urn:nbn:de:101:1-2021052115061111432371
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:45 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Liu, Han‐Ying
- Schwamm, Ryan J.
- Hill, Michael S.
- Mahon, Mary F.
- McMullin, Claire L.
- Rajabi, Nasir A.
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![Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]](/assets/placeholder/searchResultMediaNoDigitisedMedia.png)
Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]
Ambiphilic Al−Cu Bonding
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Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)
Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
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Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate
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Untersuchung der Phasendiagramme Cu-Ti-Al und Cu-Zr-Al und Ermittlung der Wasserstofflöslichkeit in den Heuslerphasen Cu2TiAl [CuTiAl] und Cu2ZrAl [CuZrAl]
Ambiphilic Al−Cu Bonding
Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers
Cu/Fe Nanolayered Composites Processed by Accumulative Roll-Bonding (ARB)
Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
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Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
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Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold-Rolled Cu/Al Clad Plate
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