Development of ferritic steels for application as interconnect materials for intermediate temperature solid oxide fuel cells (SOFCs)
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Maße
-
30 cm
- Umfang
-
208 S.
- Sprache
-
Englisch
- Anmerkungen
-
Ill., graph. Darst.
Zugl.: Madrid, Univ., Diss. Fco. Javier Pirón Abellán, 2003
- Erschienen in
-
Berichte des Forschungszentrums Jülich / Forschungszentrum Jülich ; 4170
- Klassifikation
-
Ingenieurwissenschaften und Maschinenbau
- Ereignis
-
Veröffentlichung
- (wo)
-
Jülich
- (wer)
-
Forschungszentrum, Zentralbibliothek
- (wann)
-
2005
- Urheber
-
Pirón Abellán, Fco. Javier
Quadakkers, Willem Joseph
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 14:21 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Pirón Abellán, Fco. Javier
- Quadakkers, Willem Joseph
- Forschungszentrum, Zentralbibliothek
Entstanden
- 2005
Ähnliche Objekte (12)
The Effect of Metallic Co-Coating Thickness on Ferritic Stainless Steels Intended for Use as Interconnect Material in Intermediate Temperature Solid Oxide Fuel Cells
Solid oxide fuel cell interconnect design optimization considering the thermal stresses
Interconnect technology for three-dimensional chip integration
Interconnect technology for three-dimensional chip integration
Wireless Interconnect for Board and Chip Level
Lateral Electrochemical Metallization Cells for Reconfigurable Interconnect Systems
Interconnect technologies for very large spiking neural networks
Interface stability in solid oxide fuel cells for intermediate temperature applications
Characterization and quantification of metallic interconnect degradation in solid oxide fuel cell stacks
Interconnect planning for physical design of 3D integrated circuits
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
Interconnect Planning for Physical Design of 3D Integrated Circuits
The Effect of Metallic Co-Coating Thickness on Ferritic Stainless Steels Intended for Use as Interconnect Material in Intermediate Temperature Solid Oxide Fuel Cells
Solid oxide fuel cell interconnect design optimization considering the thermal stresses
Interconnect technology for three-dimensional chip integration
Interconnect technology for three-dimensional chip integration
Wireless Interconnect for Board and Chip Level
Lateral Electrochemical Metallization Cells for Reconfigurable Interconnect Systems
Interconnect technologies for very large spiking neural networks
Interface stability in solid oxide fuel cells for intermediate temperature applications
Characterization and quantification of metallic interconnect degradation in solid oxide fuel cell stacks
Interconnect planning for physical design of 3D integrated circuits
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
Interconnect Planning for Physical Design of 3D Integrated Circuits
The Effect of Metallic Co-Coating Thickness on Ferritic Stainless Steels Intended for Use as Interconnect Material in Intermediate Temperature Solid Oxide Fuel Cells
Solid oxide fuel cell interconnect design optimization considering the thermal stresses
Interconnect technology for three-dimensional chip integration
Interconnect technology for three-dimensional chip integration
Wireless Interconnect for Board and Chip Level
Lateral Electrochemical Metallization Cells for Reconfigurable Interconnect Systems
Interconnect technologies for very large spiking neural networks
Interface stability in solid oxide fuel cells for intermediate temperature applications
Characterization and quantification of metallic interconnect degradation in solid oxide fuel cell stacks
Interconnect planning for physical design of 3D integrated circuits
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits