- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource, 1 online resource.
- Language
-
Englisch
- Bibliographic citation
-
New Solder Based on the Sn-Zn Eutectic with Addition of Ag, Al, and Li ; volume:32 ; number:13 ; day:23 ; month:3 ; year:2023 ; pages:5710-5722 ; date:7.2023
Journal of materials engineering and performance ; 32, Heft 13 (23.3.2023), 5710-5722, 7.2023
- Classification
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Ingenieurwissenschaften und Maschinenbau
- Creator
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Dybeł, Aleksandra
Pstruś, Janusz
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s11665-023-08103-0
- URN
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urn:nbn:de:101:1-2023100408590479670079
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:45 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Dybeł, Aleksandra
- Pstruś, Janusz
- SpringerLink (Online service)
Other Objects (12)
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Early stages of wetting of copper by Sn–Zn eutectic alloy
Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
The influence of Li on the thermophysical properties of liquid Ga–Sn–Zn eutectic alloys
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Early stages of wetting of copper by Sn–Zn eutectic alloy
Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
The influence of Li on the thermophysical properties of liquid Ga–Sn–Zn eutectic alloys
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder
Fatigue fracture of SnAgCu solder joints by microstructural modeling
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Early stages of wetting of copper by Sn–Zn eutectic alloy
Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys
Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
The influence of Li on the thermophysical properties of liquid Ga–Sn–Zn eutectic alloys
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder