Hochschulschrift
Thermo-mechanical reliability of flip-chip assemblies with heat spreaders
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Language
-
Englisch
- Notes
-
Berlin, Techn. Univ., Diss., 2003
- Keyword
-
Flip-Chip-Technologie
Lötverbindung
Temperaturwechselbeständigkeit
Mechanische Beanspruchung
Lebensdauer
Finite-Elemente-Methode
- Creator
- URN
-
urn:nbn:de:kobv:83-opus-5665
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
25.03.2025, 1:49 PM CET
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
Other Objects (12)
Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices
Thermo-mechanical modeling for selective laser melting
Thermo-mechanical modeling for selective laser melting
Failure analysis of coatings under thermo-mechanical loading
Thermo‐mechanical analysis of a steam turbine rotor
Thermo-mechanical behavior of NiAl thin films
Thermo-Mechanical Behavior of Honeycomb, Porous, Microcracked Ceramics
Special Issue: Thermo-Mechanical Behaviour of Structural Lightweight Alloys
3rd Workshop on Thermo-Mechanical Fatique - Interntional TMF-Workshop
Towards a thermo-mechanical characterization approach of buildings' envelope
Special Issue: Thermo-Mechanical Behaviour of Structural Lightweight Alloys
Thermo-mechanical investigations and predictions for oxygen transport membrane materials
Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices
Thermo-mechanical modeling for selective laser melting
Thermo-mechanical modeling for selective laser melting
Failure analysis of coatings under thermo-mechanical loading
Thermo‐mechanical analysis of a steam turbine rotor
Thermo-mechanical behavior of NiAl thin films
Thermo-Mechanical Behavior of Honeycomb, Porous, Microcracked Ceramics
Special Issue: Thermo-Mechanical Behaviour of Structural Lightweight Alloys
3rd Workshop on Thermo-Mechanical Fatique - Interntional TMF-Workshop
Towards a thermo-mechanical characterization approach of buildings' envelope
Special Issue: Thermo-Mechanical Behaviour of Structural Lightweight Alloys
Thermo-mechanical investigations and predictions for oxygen transport membrane materials
Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices
Thermo-mechanical modeling for selective laser melting
Thermo-mechanical modeling for selective laser melting
Failure analysis of coatings under thermo-mechanical loading
Thermo‐mechanical analysis of a steam turbine rotor
Thermo-mechanical behavior of NiAl thin films
Thermo-Mechanical Behavior of Honeycomb, Porous, Microcracked Ceramics
Special Issue: Thermo-Mechanical Behaviour of Structural Lightweight Alloys
3rd Workshop on Thermo-Mechanical Fatique - Interntional TMF-Workshop
Towards a thermo-mechanical characterization approach of buildings' envelope
Special Issue: Thermo-Mechanical Behaviour of Structural Lightweight Alloys