Hochschulschrift
Thermo-mechanical reliability of flip-chip assemblies with heat spreaders
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Sprache
-
Englisch
- Anmerkungen
-
Berlin, Techn. Univ., Diss., 2003
- Schlagwort
-
Flip-Chip-Technologie
Lötverbindung
Temperaturwechselbeständigkeit
Mechanische Beanspruchung
Lebensdauer
Finite-Elemente-Methode
- Urheber
- URN
-
urn:nbn:de:kobv:83-opus-5665
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:49 MEZ
Datenpartner
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Objekttyp
- Hochschulschrift
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