Deep Learning-Based Detection of Defects in Wafer Buffer Zone During Semiconductor Packaging Process
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
1 Online-Ressource.
- Sprache
-
Englisch
- Erschienen in
-
Deep Learning-Based Detection of Defects in Wafer Buffer Zone During Semiconductor Packaging Process ; day:14 ; month:2 ; year:2024 ; pages:1-8
Multiscale science and engineering ; (14.2.2024), 1-8
- Urheber
-
Kim, Tae-Yeon
Park, Sunjae
Lim, Chang-Kue
Choi, Jae-Hyuk
An, Chang-Hyun
Song, Lak-Hyun
Kim, Do-Nyun
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s42493-024-00103-z
- URN
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urn:nbn:de:101:1-2404221151459.572662771159
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:55 MESZ
Datenpartner
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Beteiligte
- Kim, Tae-Yeon
- Park, Sunjae
- Lim, Chang-Kue
- Choi, Jae-Hyuk
- An, Chang-Hyun
- Song, Lak-Hyun
- Kim, Do-Nyun
- SpringerLink (Online service)
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