- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
-
online resource.
- Bibliographic citation
-
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures ; volume:50 ; number:3 ; day:16 ; month:1 ; year:2021 ; pages:926-938 ; date:3.2021
Journal of electronic materials ; 50, Heft 3 (16.1.2021), 926-938, 3.2021
- Creator
-
Gu, Tianhong
Gourlay, Christopher M.
Britton, T. Ben
- Contributor
-
SpringerLink (Online service)
- DOI
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10.1007/s11664-020-08697-4
- URN
-
urn:nbn:de:101:1-2021040702321249395460
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:56 AM CEST
Data provider
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Associated
- Gu, Tianhong
- Gourlay, Christopher M.
- Britton, T. Ben
- SpringerLink (Online service)
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The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys
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The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Development of a viscoplastic-damage model for creep-fatigue FE-calculations of the lead-free SnAgCu solder alloy for automotive applications
Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Influence of the Substrate on the Creep of SN Solder Joints
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Development of a viscoplastic-damage model for creep-fatigue FE-calculations of the lead-free SnAgCu solder alloy for automotive applications
Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys
Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification
Hybrid solder joints: the effect of nanosized ZrO2 particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications