- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
online resource.
- Erschienen in
-
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures ; volume:50 ; number:3 ; day:16 ; month:1 ; year:2021 ; pages:926-938 ; date:3.2021
Journal of electronic materials ; 50, Heft 3 (16.1.2021), 926-938, 3.2021
- Urheber
-
Gu, Tianhong
Gourlay, Christopher M.
Britton, T. Ben
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-020-08697-4
- URN
-
urn:nbn:de:101:1-2021040702321249395460
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:56 MESZ
Datenpartner
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Beteiligte
- Gu, Tianhong
- Gourlay, Christopher M.
- Britton, T. Ben
- SpringerLink (Online service)
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