Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1543-186X
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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online resource.
- Bibliographic citation
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Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations ; volume:37 ; number:6 ; day:14 ; month:3 ; year:2008 ; pages:792-805 ; date:6.2008
Journal of electronic materials ; 37, Heft 6 (14.3.2008), 792-805, 6.2008
- Creator
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Vuorinen, V.
Yu, H.
Laurila, T.
Kivilahti, J.K
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s11664-008-0411-x
- URN
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urn:nbn:de:101:1-2021082320234774750087
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 11:00 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Vuorinen, V.
- Yu, H.
- Laurila, T.
- Kivilahti, J.K
- SpringerLink (Online service)
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Lateral diffusion spreading of two competitive intermetallic phases along free surface (system Cu-Sn) : Lateral diffusion spreading of two competitive intermetallicphases along free surface (system Cu-Sn)
Composition templating for heterogeneous nucleation of intermetallic compounds
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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Gradient-level and nonlocal density functional descriptions of Cu-Au intermetallic compounds
Experimental and theoretical studies of Cu-Sn intermetallic phase growth during high-temperature storage of eutectic SnAg interconnects
Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects
Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
Active site isolation for the selective hydrogenation of acetylene: the Pd-Ga and Pd-Sn intermetallic compounds
Lateral diffusion spreading of two competitive intermetallic phases along free surface (system Cu-Sn) : Lateral diffusion spreading of two competitive intermetallicphases along free surface (system Cu-Sn)
Composition templating for heterogeneous nucleation of intermetallic compounds
Statistical thermodynamics of ordered intermetallic compounds containing point defects
Thermal Transport in Strongly Correlated Rare-Earth Intermetallic Compounds
Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys
Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Gradient-level and nonlocal density functional descriptions of Cu-Au intermetallic compounds
Experimental and theoretical studies of Cu-Sn intermetallic phase growth during high-temperature storage of eutectic SnAg interconnects
Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects
Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
Active site isolation for the selective hydrogenation of acetylene: the Pd-Ga and Pd-Sn intermetallic compounds
Lateral diffusion spreading of two competitive intermetallic phases along free surface (system Cu-Sn) : Lateral diffusion spreading of two competitive intermetallicphases along free surface (system Cu-Sn)
Composition templating for heterogeneous nucleation of intermetallic compounds
Statistical thermodynamics of ordered intermetallic compounds containing point defects