Hochschulschrift
Through-silicon vias in SiGe BiCMOS and interposer technologies for sub-THz applications
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783961001965
3961001960
- Dimensions
-
21 cm, 320 g
- Extent
-
210 Seiten
- Language
-
Englisch
- Notes
-
Illustrationen, Diagramme
Technische Universität Chemnitz, Dissertation, 2023
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Silicium-Durchkontaktierung
BICMOS
Wafer level packaging
- Event
-
Veröffentlichung
- (where)
-
[Chemnitz]
- (who)
-
Universitätsverlag Chemnitz
- (when)
-
2023
- Creator
- Contributor
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 2:24 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
- Wietstruck, Matthias
- Universitätsbibliothek. Chemnitz
- Universitätsverlag Chemnitz
Time of origin
- 2023
Other Objects (12)
Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
CMOS - top down : silicon nanoelectronics, silicon optoelectronics, strained silicon
SiGe BiCMOS integrated circuits for optical communication transmitters
MM-wave RF-MEMS switches in SiGe BiCMOS technologies
High speed current-steering DACs in SiGe BiCMOS technology
Electromagnetic modeling and optimization of through silicon vias
Electromagnetic modeling and optimization of through silicon vias
245 GHz subharmonic receivers for gas spectroscopy in SiGe BiCMOS technology : = 245 GHz subharmonische Empfänger für die Gas-Spektroskopie in SiGe BiCMOS Technologie
Scalable integrated radar transceiver front-ends in SiGe BiCMOS technology
Millimeter-wave phased-array radio front-ends in SiGe BiCMOS technologies
MEMS module integration into SiGe BiCMOS technology for embedded system applications
245 GHz subharmonic receivers for gas spectroscopy in SiGe BiCMOS technology
Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
CMOS - top down : silicon nanoelectronics, silicon optoelectronics, strained silicon
SiGe BiCMOS integrated circuits for optical communication transmitters
MM-wave RF-MEMS switches in SiGe BiCMOS technologies
High speed current-steering DACs in SiGe BiCMOS technology
Electromagnetic modeling and optimization of through silicon vias
Electromagnetic modeling and optimization of through silicon vias
245 GHz subharmonic receivers for gas spectroscopy in SiGe BiCMOS technology : = 245 GHz subharmonische Empfänger für die Gas-Spektroskopie in SiGe BiCMOS Technologie
Scalable integrated radar transceiver front-ends in SiGe BiCMOS technology
Millimeter-wave phased-array radio front-ends in SiGe BiCMOS technologies
MEMS module integration into SiGe BiCMOS technology for embedded system applications
245 GHz subharmonic receivers for gas spectroscopy in SiGe BiCMOS technology
Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
CMOS - top down : silicon nanoelectronics, silicon optoelectronics, strained silicon
SiGe BiCMOS integrated circuits for optical communication transmitters
MM-wave RF-MEMS switches in SiGe BiCMOS technologies
High speed current-steering DACs in SiGe BiCMOS technology
Electromagnetic modeling and optimization of through silicon vias
Electromagnetic modeling and optimization of through silicon vias
245 GHz subharmonic receivers for gas spectroscopy in SiGe BiCMOS technology : = 245 GHz subharmonische Empfänger für die Gas-Spektroskopie in SiGe BiCMOS Technologie
Scalable integrated radar transceiver front-ends in SiGe BiCMOS technology
Millimeter-wave phased-array radio front-ends in SiGe BiCMOS technologies
MEMS module integration into SiGe BiCMOS technology for embedded system applications