Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
0975-1645
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder ; day:7 ; month:8 ; year:2021 ; pages:1-9
Transactions of the Indian Institute of Metals / Indian Institute of Metals ; (7.8.2021), 1-9
- Creator
-
Yuan, Biao
Liang, Zhimin
Yang, Zongyuan
Shen, Fei
Xu, Da
Wang, Liwei
Wei, Shaowei
Wang, Dianlong
- Contributor
-
SpringerLink (Online service)
- DOI
-
10.1007/s12666-021-02362-y
- URN
-
urn:nbn:de:101:1-2021103100092579455272
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
15.08.2025, 7:38 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Yuan, Biao
- Liang, Zhimin
- Yang, Zongyuan
- Shen, Fei
- Xu, Da
- Wang, Liwei
- Wei, Shaowei
- Wang, Dianlong
- SpringerLink (Online service)
Other Objects (12)
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Research into the interface of lead-free solder joints
Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
Micromechanical characterization of lead-free solder and its individual microstructure elements
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
New Solder Based on the Sn-Zn Eutectic with Addition of Ag, Al, and Li
Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Research into the interface of lead-free solder joints
Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
Micromechanical characterization of lead-free solder and its individual microstructure elements
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
New Solder Based on the Sn-Zn Eutectic with Addition of Ag, Al, and Li
Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints
Investigations of microstructural changes in lead-free solder alloys by means of phase field theories
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
Research into the interface of lead-free solder joints
Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
Micromechanical characterization of lead-free solder and its individual microstructure elements
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution
New Solder Based on the Sn-Zn Eutectic with Addition of Ag, Al, and Li
Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints