Hochschulschrift
Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783961475070
3961475075
- Dimensions
-
24 cm, 404 g
- Extent
-
x, 112 Seiten
- Language
-
Englisch
- Notes
-
Illustrationen, Diagramme
Friedrich-Alexander-Universität Erlangen-Nürnberg, Dissertation, 2021
- Bibliographic citation
-
FAU Studien aus dem Maschinenbau ; Band 388
- Classification
-
Industrielle und handwerkliche Fertigung
- Keyword
-
Verbindungstechnik
Löten
Laser
Elektrotechnik
Aufbau- und Verbindungstechnik
Ingenieurwissenschaften
Maschinenbau
Produktionstechnik
- Event
-
Veröffentlichung
- (where)
-
Erlangen
- (who)
-
FAU University Press
- (when)
-
2022
- Creator
- Contributor
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 1:45 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
Time of origin
- 2022
Other Objects (12)
Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements
Fuel Cell Electronics Packaging
Modeling and application of flexible electronics packaging
Packaging technologies for power electronics in automotive applications
Broadband Photodetectors and Imagers in Stretchable Electronics Packaging
Diffusion Soldering for High-temperature Packaging of Power Electronics
Bonding mechanisms in laser-assisted joining of metal-polymer composites
Drop Test Simulation of Packaging for Dangerous Goods: An Investigation of Appropriate Drop Height Adjustment in Case of Deviating Packaging Gross Mass
Diffusion soldering for the high-temperature packaging of power electronics
3D thin electronics packaging technologies for mobile and wearable applications
Investigations on a Packaging Technology for PCB Integrated Power Electronics
Dissimilar material joining of densified superwood to aluminum by adhesive bonding
Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements
Fuel Cell Electronics Packaging
Modeling and application of flexible electronics packaging
Packaging technologies for power electronics in automotive applications
Broadband Photodetectors and Imagers in Stretchable Electronics Packaging
Diffusion Soldering for High-temperature Packaging of Power Electronics
Bonding mechanisms in laser-assisted joining of metal-polymer composites
Drop Test Simulation of Packaging for Dangerous Goods: An Investigation of Appropriate Drop Height Adjustment in Case of Deviating Packaging Gross Mass
Diffusion soldering for the high-temperature packaging of power electronics
3D thin electronics packaging technologies for mobile and wearable applications
Investigations on a Packaging Technology for PCB Integrated Power Electronics
Dissimilar material joining of densified superwood to aluminum by adhesive bonding
Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements
Fuel Cell Electronics Packaging
Modeling and application of flexible electronics packaging
Packaging technologies for power electronics in automotive applications
Broadband Photodetectors and Imagers in Stretchable Electronics Packaging
Diffusion Soldering for High-temperature Packaging of Power Electronics
Bonding mechanisms in laser-assisted joining of metal-polymer composites
Drop Test Simulation of Packaging for Dangerous Goods: An Investigation of Appropriate Drop Height Adjustment in Case of Deviating Packaging Gross Mass
Diffusion soldering for the high-temperature packaging of power electronics
3D thin electronics packaging technologies for mobile and wearable applications
Investigations on a Packaging Technology for PCB Integrated Power Electronics