Thermal management materials for electronic packaging : preparation, characterization, and devices
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783527352425
3527352422
- Maße
-
25 cm, 826 g
- Umfang
-
xvii, 341 Seiten
- Sprache
-
Englisch
- Anmerkungen
-
Illustrationen
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Halbleitergehäuse
Wärmeleitfähigkeit
- Ereignis
-
Veröffentlichung
- (wo)
-
Weinheim, Germany
- (wer)
-
Wiley-VCH
- (wann)
-
[2024]
- Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 13:42 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Tian, Xingyou
- Wiley-VCH
- Wiley-VCH
Entstanden
- [2024]
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