Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
In: Semiconductor Conference Dresden (SCD), 27-28 Sept. 2011, Dresden, Germany; DOI: 10.1109/SCD.2011.6068736
- Keyword
-
Atomlagenabscheidung
Kupferoxid
Ruthenium
Metallisieren
Galvanische Beschichtung
Kupfer
- Event
-
Veröffentlichung
- (where)
-
Chemnitz
- (who)
-
Universitätsbibliothek Chemnitz
- (when)
-
2012
- Event
-
Veröffentlichung
- (where)
-
Chemnitz
- (who)
-
Technische Universität Chemnitz
- (when)
-
2012
- Creator
-
Mueller, Steve
Waechtler, Thomas
Hofmann, Lutz
Tuchscherer, Andre
Mothes, Robert
Gordan, Ovidiu
Lehmann, Daniel
Haidu, Francisc
Ogiewa, Marcel
Gerlich, Lukas
Ding, Shao-Feng
Schulz, Stefan E.
Gessner, Thomas
Lang, Heinrich
Zahn, Dietrich R. T.
Qu, Xin-Ping
- URN
-
urn:nbn:de:bsz:ch1-qucosa-84003
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:59 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Mueller, Steve
- Waechtler, Thomas
- Hofmann, Lutz
- Tuchscherer, Andre
- Mothes, Robert
- Gordan, Ovidiu
- Lehmann, Daniel
- Haidu, Francisc
- Ogiewa, Marcel
- Gerlich, Lukas
- Ding, Shao-Feng
- Schulz, Stefan E.
- Gessner, Thomas
- Lang, Heinrich
- Zahn, Dietrich R. T.
- Qu, Xin-Ping
- Universitätsbibliothek Chemnitz
- Technische Universität Chemnitz
Time of origin
- 2012
Other Objects (12)
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ALD of Copper and Copper Oxide Thin Films For Applications in Metallization Systems of ULSI Devices
ALA.-ALD.
38. Die schädliche Cux.
Superconducting spintronic heat engine
Interconnect reliability and test
ESR-spektroskopische und magnetische Untersuchungen am quasi-eindimensionalen Kupfer-cyclo-tetraphosphat und den Mischungsreihen Mg2-xCuxP4O12 [MgxCuxPO] und Co2-xCuxP4O12 [CoxCuxPO]
Hein Mück & Jan Cux : Roman
Fiber-tip spintronic terahertz emitters
Nitride nanostructures for spintronic applications
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Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
Characterization and Process Development of CVD/ALD-based Cu(Mn)/Co(W) Interconnect System
ALD of Copper and Copper Oxide Thin Films For Applications in Metallization Systems of ULSI Devices
ALA.-ALD.
38. Die schädliche Cux.
Superconducting spintronic heat engine
Interconnect reliability and test
ESR-spektroskopische und magnetische Untersuchungen am quasi-eindimensionalen Kupfer-cyclo-tetraphosphat und den Mischungsreihen Mg2-xCuxP4O12 [MgxCuxPO] und Co2-xCuxP4O12 [CoxCuxPO]
Hein Mück & Jan Cux : Roman
Fiber-tip spintronic terahertz emitters
Nitride nanostructures for spintronic applications
Lateral Electrochemical Metallization Cells for Reconfigurable Interconnect Systems
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
Characterization and Process Development of CVD/ALD-based Cu(Mn)/Co(W) Interconnect System
ALD of Copper and Copper Oxide Thin Films For Applications in Metallization Systems of ULSI Devices
ALA.-ALD.
38. Die schädliche Cux.
Superconducting spintronic heat engine
Interconnect reliability and test
ESR-spektroskopische und magnetische Untersuchungen am quasi-eindimensionalen Kupfer-cyclo-tetraphosphat und den Mischungsreihen Mg2-xCuxP4O12 [MgxCuxPO] und Co2-xCuxP4O12 [CoxCuxPO]
Hein Mück & Jan Cux : Roman
Fiber-tip spintronic terahertz emitters