Modelling of chemical shrinkage evolution with curing degree of a filled epoxy adhesive
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Anmerkungen
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In: Holst, T.; Sayer, F.; Antoniou, A.: Modelling of chemical shrinkage evolution with curing degree of a filled epoxy adhesive. In: 41st Risø International Symposium on Materials Science: "Materials and Design for Next Generation Wind Turbine Blades". London [u.a.] : Institute of Physics, 2020 (IOP Conference Series: Materials Science and Engineering ; 942), 012020. DOI: https://doi.org/10.1088/1757-899x/942/1/012020
- Ereignis
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Veröffentlichung
- (wo)
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Hannover
- (wer)
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Gottfried Wilhelm Leibniz Universität Hannover
- (wann)
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2020
- Ereignis
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Veröffentlichung
- (wo)
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Hannover
- (wer)
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Technische Informationsbibliothek (TIB)
- (wann)
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2020
- Urheber
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Holst, T.
Sayer, F.
Antoniou, A.
- DOI
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10.15488/16454
- URN
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urn:nbn:de:101:1-2024031401130285935338
- Rechteinformation
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Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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25.03.2025, 13:51 MEZ
Datenpartner
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Beteiligte
- Holst, T.
- Sayer, F.
- Antoniou, A.
- Gottfried Wilhelm Leibniz Universität Hannover
- Technische Informationsbibliothek (TIB)
Entstanden
- 2020
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